| Portable & Wireless Communications. |
| Smaller & Lighter Weight. |
| |
| Wide Bandwidth & High Speed. |
| Real Time Information. |
| |
| Personal Communication. |
| Cheaper, Lower Cost. |
| |
| Dimensions To Become Smaller, Thinner, Weight Wants Lighter. |
| Flip Chip, One-Chip ASIC. |
| |
| Frequencies To Become Higher, Noise Wants Lower. |
| Pll CKT, Inverted Mesa Blanks. |
| |
| The Cost To Become Lower. |
| Single Layer Package, Array Type Production. |
